Samsung Electronics has announced on its blog a thinner Exynos 7 chip that is made on the 14nm process and is likely to power its next flagship smartphones, Galaxy S6 and S6 Edge.
The new Exynos 7 octa-core chips will be much thinner than the current-generation silicones that are made on the 20nm process.
In the Samsung Tomorrow blog, the company said that the new chip, made using the 14nm 3D FinFET process technology, will deliver up to 20% faster speed, increase productivity by up to 35% and consume 35% less power compared to the 20nm units.
Samsung is expected to use Exynos 7 chips based on the 14nm 3D FinFET process in the upcoming Galaxy S6 and S6 Edge as it has reportedly encountered overheating issues with the Qualcomm Snapdragon 810 64-bit processor.
Qualcomm in a statement had earlier said that one of its large customers will not use its chip in flagship models; the customer is widely considered to be Samsung. However, the likes of Motorola, HTC, LG etc will continue to use Qualcomm chips in their top products of 2015.
The new Exynos 7 octa-core chips will be much thinner than the current-generation silicones that are made on the 20nm process.
In the Samsung Tomorrow blog, the company said that the new chip, made using the 14nm 3D FinFET process technology, will deliver up to 20% faster speed, increase productivity by up to 35% and consume 35% less power compared to the 20nm units.
Samsung is expected to use Exynos 7 chips based on the 14nm 3D FinFET process in the upcoming Galaxy S6 and S6 Edge as it has reportedly encountered overheating issues with the Qualcomm Snapdragon 810 64-bit processor.
Qualcomm in a statement had earlier said that one of its large customers will not use its chip in flagship models; the customer is widely considered to be Samsung. However, the likes of Motorola, HTC, LG etc will continue to use Qualcomm chips in their top products of 2015.
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